Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5582341 | Bonding apparatus for terminal component | Shinji Kanayama, Akira Kabeshita, Kenichi Nishino, Nobuhiko Muraoka | 1996-12-10 |
| 5462626 | Method of bonding an external lead and a tool therefor | Shinji Kanayama, Akira Kabeshita, Kenichi Nishino, Takahiko Murata, Kazuhiro Kimura +1 more | 1995-10-31 |