KF

Kazuki Fukada

PA Panasonic: 14 patents #1,670 of 21,108Top 8%
Sumitomo Electric Industries: 3 patents #7,735 of 21,551Top 40%
Overall (All Time): #272,365 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
11198294 Inkjet head, inkjet coating device, and inkjet coating method 2021-12-14
10913088 Coating nozzle head, and liquid-applying apparatus including the same Tohru Nakagawa, Hidehiro Yoshida 2021-02-09
10112389 Inkjet head and coating apparatus using same Kenichi Yamamoto, Tohru Nakagawa, Kazunobu Irie, Takeshi Kita, Hidehiro Yoshida 2018-10-30
9855747 Inkjet head and inkjet device Hidehiro Yoshida, Kenichi Yamamoto, Takeshi Kita 2018-01-02
9080728 Wiping device, ink-jet device, and wiping method Teiichi Kimura 2015-07-14
8827427 Ink-jet head and ink-jet apparatus Hidehiro Yoshida 2014-09-09
8727507 Ink-jet apparatus Hiroshi Hayata, Hidehiro Yoshida 2014-05-20
8646878 Ink-jet head Hidehiro Yoshida 2014-02-11
8602533 Ink jet head and ink jet device having the same Hidehiro Yoshida, Keisei Yamamuro 2013-12-10
8579420 Ink-jet apparatus Hidehiro Yoshida, Keisei Yamamuro 2013-11-12
8567921 Ink-jet apparatus Hidehiro Yoshida, Keisei Yamamuro 2013-10-29
8567925 Ink-jet head, ink-jet apparatus, and method of manufacturing the same Hidehiro Yoshida, Keisei Yamamuro 2013-10-29
8303080 Ink-jet head and ink-jet apparatus Hidehiro Yoshida 2012-11-06
7659148 Bonding method and apparatus Tatsuo Sasaoka, Satoshi Horie, Isamu Aokura, Yoshihiko Yagi 2010-02-09
7357288 Component connecting apparatus Naoto Hosotani, Keiichi Iwata, Daido Komyoji 2008-04-15
6995342 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus Hiroshi Yamauchi, Naoto Hosotani, Katsuhiko Watanabe 2006-02-07
6797926 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus Hiroshi Yamauchi, Naoto Hosotani, Katsuhiko Watanabe 2004-09-28