Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6328196 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa +2 more | 2001-12-11 |
| 6321973 | Bump joining method | Shozo Minamitani, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa | 2001-11-27 |
| 6264704 | Method and apparatus for mounting component | Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Satoshi Shida +1 more | 2001-07-24 |
| 6207549 | Method of forming a ball bond using a bonding capillary | Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2001-03-27 |
| 6193136 | Component mounting method and apparatus | Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2001-02-27 |
| 5686353 | Semiconductor device and manufacturing method thereof | Yoshihiko Yagi, Norihito Tsukahara, Koichi Kumagai, Takahiro Yonezawa | 1997-11-11 |