Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6572005 | Bump-joining method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Hiroshi Wada, Takafumi Tsujisawa | 2003-06-03 |
| 6568580 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2003-05-27 |
| 6506222 | Method and apparatus for mounting component | Shozo Minamitani, Takashi Shimizu, Kenji Takahashi, Kazushi Higashi, Satoshi Shida +1 more | 2003-01-14 |
| 6494358 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2002-12-17 |
| 6467670 | Method and apparatus for mounting component | Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Kenji Takahashi | 2002-10-22 |
| 6467158 | Component feeder with load position alignment recognition | Hiroyuki Kiyomura, Nobuya Matsumura, Kenji Takahashi, Hiroshi Nasu | 2002-10-22 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Hiroshi Wada, Takafumi Tsujisawa +4 more | 2002-08-27 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2002-05-21 |
| 6332268 | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Makoto Imanishi, Yoshifumi Kitayama, Koichi Kumagai, Yoshinori Wada, Takahiro Yonezawa +1 more | 2001-12-25 |
| 6329640 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2001-12-11 |
| 6321973 | Bump joining method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Hiroshi Wada, Takafumi Tsujisawa | 2001-11-27 |
| 6302317 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2001-10-16 |
| 6264704 | Method and apparatus for mounting component | Shozo Minamitani, Takashi Shimizu, Kenji Takahashi, Kazushi Higashi, Satoshi Shida +1 more | 2001-07-24 |
| 6193136 | Component mounting method and apparatus | Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Kenji Takahashi | 2001-02-27 |
| 6129203 | IC discarding apparatus for flip chip mounting facility | Hiroyuki Kiyomura, Nobuya Matsumura, Kenichi Nishino, Kenji Takahashi, Naomi Kainou | 2000-10-10 |
| 6055724 | Method and device for sealing IC chip | Kenichi Nishino, Hiroyuki Otani, Kohei Enchi, Hiroyuki Yoshida | 2000-05-02 |
| 6017812 | Bump bonding method and bump bonding apparatus | Takahiro Yonezawa, Osamu Nakao, Akihiro Yamamoto, Makoto Imanishi, Koichi Yoshida | 2000-01-25 |
| 5894657 | Mounting apparatus for electronic component | Akira Kabeshita, Satoshi Shida, Kohei Enchi, Kenji Takahashi | 1999-04-20 |
| 5854745 | Method and apparatus for mounting electronic component | Nobuhiko Muraoka, Shinzo Eguchi, Masaru Ichihara, Shuichi Hirata, Nobuhisa Watanabe | 1998-12-29 |
| 5783915 | Linear actuating apparatus | Satoshi Shida, Akira Kabeshita, Kenji Takahashi, Makoto Imanishi, Osamu Nakao | 1998-07-21 |
| 5582341 | Bonding apparatus for terminal component | Akira Kabeshita, Satoshi Ohnakada, Kenichi Nishino, Nobuhiko Muraoka | 1996-12-10 |
| 5462626 | Method of bonding an external lead and a tool therefor | Akira Kabeshita, Kenichi Nishino, Satoshi Ohnakada, Takahiko Murata, Kazuhiro Kimura +1 more | 1995-10-31 |