Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8895359 | Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus | Kazumichi Shimizu, Kentaro Kumazawa | 2014-11-25 |
| 8436253 | Method of manufacturing mounting structure and mounting structure | Takayuki Higuchi, Kazuhiro Nobori, Kentaro Kumazawa | 2013-05-07 |
| 8426965 | Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool | Teppei Iwase, Kazuhiro Nobori, Yuichiro Yamada, Kentaro Kumazawa | 2013-04-23 |
| 8415794 | Semiconductor device having stable signal transmission at high speed and high frequency | Kentaro Kumazawa | 2013-04-09 |
| 8358018 | Resin sealing structure for electronic component and resin sealing method for electronic component | Makoto Imanishi, Kentaro Kumazawa | 2013-01-22 |
| 8283570 | Semiconductor assembly and multilayer wiring board | Shigeru Kondou, Teppei Iwase | 2012-10-09 |
| 8264079 | Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool | Teppei Iwase, Kazuhiro Nobori, Yuichiro Yamada, Kentaro Kumazawa | 2012-09-11 |
| 8207618 | Semiconductor device and method of manufacturing the same | Kazumichi Shimizu, Masahiro Ono | 2012-06-26 |
| 8163599 | Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus | Kentaro Kumazawa, Takayuki Higuchi, Koujiro Nakamura | 2012-04-24 |
| 8154123 | Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure | Shigeru Kondou | 2012-04-10 |
| 8110933 | Semiconductor device mounted structure and semiconductor device mounted method | Daido Komyoji | 2012-02-07 |
| 8106521 | Semiconductor device mounted structure with an underfill sealing-bonding resin with voids | Teppei Iwase, Kazuhiro Nobori | 2012-01-31 |
| 8080884 | Mounting structure and mounting method | Kojiro Nakamura, Kentaro Kumazawa | 2011-12-20 |
| 8050049 | Semiconductor device | Teppei Iwase, Kazuhiro Nobori, Koujiro Nakamura, Kentaro Kumazawa | 2011-11-01 |
| 8033016 | Method for manufacturing an electrode and electrode component mounted body | Kunio Hibino, Yoshihiko Yagi, Kazuhiro Nishikawa | 2011-10-11 |
| 7994638 | Semiconductor chip and semiconductor device | Kazuhiro Nobori, Yuichiro Yamada, Kentaro Kumazawa, Teppei Iwase | 2011-08-09 |
| 7985078 | Electrode junction structure and manufacturing method thereof | Kentaro Kumazawa, Masahiro Ono | 2011-07-26 |
| 7845954 | Interconnecting board and three-dimensional wiring structure using it | Yasushi Nakagiri, Kunio Hibino, Yoshihiko Yagi, Akihiro Miyashita, Masahiro Ono +1 more | 2010-12-07 |
| 7762819 | Substrate connecting member and connecting structure | Masato Mori, Yoshihiko Yagi, Masahiro Ono, Kunio Hibino, Yasushi Nakagiri +2 more | 2010-07-27 |
| 6613180 | Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body | Yoshitaka Sunagawa, Yoshitake Hayashi, Masayoshi Koyama, Toshiyuki Kojima, Osamu Shibata +1 more | 2003-09-02 |
| 6088236 | Semiconductor device having a bump having a rugged side | Yoshihiro Bessho | 2000-07-11 |
| 5940679 | Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage | Yoshihiro Bessho, Yoshifumi Nakamura | 1999-08-17 |
| 5670826 | Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method | Yoshihiro Bessho | 1997-09-23 |
| 5651179 | Method for mounting a semiconductor device on a circuit board | Yoshihiro Bessho | 1997-07-29 |
| 5640051 | Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex | Yoshihiro Bessho, Yasuhiko Hakotani | 1997-06-17 |