Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7001662 | Transfer sheet and wiring board using the same, and method of manufacturing the same | Hiroyuki Ishitomi, Seiichi Nakatani | 2006-02-21 |
| 6975516 | Component built-in module and method for producing the same | Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani | 2005-12-13 |
| 6969945 | Surface acoustic wave device, method for manufacturing, and electronic circuit device | Akihiko Namba, Keiji Onishi, Katsunori Moritoki | 2005-11-29 |
| 6965284 | Dielectric filter, antenna duplexer | Tomoya Maekawa, Toru Yamada, Toshio Ishizaki | 2005-11-15 |
| 6955948 | Method of manufacturing a component built-in module | Toshiyuki Asahi, Shingo Komatsu, Seiichi Nakatani | 2005-10-18 |
| 6939738 | Component built-in module and method for producing the same | Seiichi Nakatani, Toshiyuki Asahi, Shingo Komatsu | 2005-09-06 |
| 6936774 | Wiring substrate produced by transfer material method | Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-08-30 |
| 6931725 | Circuit component built-in module, radio device having the same, and method for producing the same | Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2005-08-23 |
| 6885788 | Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module | Hideki Iwaki, Yutaka Taguchi, Tetsuyoshi Ogura, Toshiyuki Asahi, Tousaku Nishiyama +1 more | 2005-04-26 |
| 6871396 | Transfer material for wiring substrate | Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-03-29 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Shingo Komatsu, Seiichi Nakatani, Toshiyuki Asahi, Yoshiyuki Yamamoto | 2005-02-15 |
| 6798121 | Module with built-in electronic elements and method of manufacture thereof | Seiichi Nakatani, Yoshihiro Bessho, Keiji Onishi | 2004-09-28 |
| 6784530 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani, Satoru Yuhaku +1 more | 2004-08-31 |
| 6734542 | Component built-in module and method for producing the same | Seiichi Nakatani, Toshiyuki Asahi, Shingo Komatsu | 2004-05-11 |
| 6696139 | Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board | Osamu Inoue, Junichi Kato | 2004-02-24 |
| 6538210 | Circuit component built-in module, radio device having the same, and method for producing the same | Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2003-03-25 |
| 6525921 | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same | Seiichi Nakatani, Koichi Hirano, Mikinari Shimada | 2003-02-25 |
| 6521069 | Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board | Osamu Inoue, Junichi Kato | 2003-02-18 |
| 6489685 | Component built-in module and method of manufacturing the same | Toshiyuki Asahi, Shingo Komatsu, Seiichi Nakatani | 2002-12-03 |
| 5352522 | Composite material comprising metallic alloy grains coated with a dielectric substance | Koichi Kugimiya, Osamu Inoue, Mitsuo Satomi, Ken Hirota | 1994-10-04 |
| 5350628 | Magnetic sintered composite material | Koichi Kugimiya, Osamu Inoue, Ken Hirota, Mitsuo Satomi | 1994-09-27 |
| 5238507 | Magnetic material | Koichi Kugimiya, Osamu Inoue, Ken Hirota, Mitsuo Satomi | 1993-08-24 |
| 5183631 | Composite material and a method for producing the same | Koichi Kugimiya, Osamu Inoue, Mitsuo Satomi, Ken Hirota | 1993-02-02 |