Issued Patents All Time
Showing 26–50 of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8501583 | Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates | Takashi Kitae, Seiji Karashima, Susumu Sawada | 2013-08-06 |
| 8435842 | Method for manufacturing flexible semiconductor device | Koichi Hirano, Tatsuo Ogawa | 2013-05-07 |
| 8367488 | Manufacturing method of flexible semiconductor device | Takashi Ichiryu, Koichi Hirano | 2013-02-05 |
| 8343822 | Flexible semiconductor device and method for manufacturing same | Koichi Hirano, Tatsuo Ogawa, Takashi Ichiryu, Takeshi Suzuki | 2013-01-01 |
| 8324623 | Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip | Koichi Hirano, Tetsuyoshi Ogura | 2012-12-04 |
| 8297488 | Bump forming method using self-assembling resin and a wall surface | Seiji Karashima, Yasushi Taniguchi, Kenichi Hotehama, Takashi Kitae, Susumu Sawada | 2012-10-30 |
| 8288778 | Semiconductor device having semiconductor elements formed inside a resin film substrate | Yoshihisa Yamashita, Takashi Kitae, Susumu Sawada | 2012-10-16 |
| 8283246 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu | 2012-10-09 |
| 8193526 | Transistor having an organic semiconductor with a hollow space | Yoshihisa Yamashita, Takashi Kitae, Susumu Sawada | 2012-06-05 |
| 8143617 | Semiconductor device, semiconductor device manufacturing method and image display device | Yoshihisa Yamashita | 2012-03-27 |
| 8097958 | Flip chip connection structure having powder-like conductive substance and method of producing the same | Susumu Sawada, Seiji Karashima, Takashi Kitae | 2012-01-17 |
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima | 2011-12-06 |
| 8064213 | Module with a built-in component, and electronic device with the same | Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Tousaku Nishiyama | 2011-11-22 |
| 8063486 | Circuit board, method for manufacturing the same, and semiconductor device | Koichi Hirano, Tsukasa Shiraishi, Tatsuo Ogawa | 2011-11-22 |
| 8039307 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Yoshihisa Yamashita, Takashi Kitae, Shingo Komatsu | 2011-10-18 |
| 8012801 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae | 2011-09-06 |
| 7981528 | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same | Yoshihisa Yamashita, Takashi Ichiryu, Koichi Hirano | 2011-07-19 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Shingo Komatsu, Yoshihisa Yamashita, Takashi Ichiryu | 2011-07-12 |
| 7963310 | Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film | Tsukasa Shiraishi | 2011-06-21 |
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu | 2011-05-31 |
| 7943518 | Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip | Koichi Hirano, Tetsuyoshi Ogura | 2011-05-17 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Yoshihiro Tomita | 2011-04-19 |
| 7921551 | Electronic component mounting method | Yoshihisa Yamashita, Seiji Karashima, Takashi Kitae, Toshiyuki Kojima, Shingo Komatsu | 2011-04-12 |
| 7919357 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates | Susumu Sawada, Seiji Karashima, Takashi Kitae | 2011-04-05 |
| 7911064 | Mounted body and method for manufacturing the same | Shingo Komatsu, Seiji Karashima, Toshiyuki Kojima, Takashi Kitae, Yoshihisa Yamashita | 2011-03-22 |