Issued Patents All Time
Showing 76–100 of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7531754 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Satoru Tomekawa, Toshio Fujii +1 more | 2009-05-12 |
| 7488895 | Method for manufacturing component built-in module, and component built-in module | Yoshitake Hayashi, Masayoshi Koyama, Satoru Yuhaku, Kazuo Otani, Susumu Matsuoka +1 more | 2009-02-10 |
| 7443021 | Electronic component packaging structure and method for producing the same | — | 2008-10-28 |
| 7400512 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor | Koichi Hirano, Tsunenori Yoshida | 2008-07-15 |
| 7394663 | Electronic component built-in module and method of manufacturing the same | Yoshihisa Yamashita, Koichi Hirano, Yasuhiro Sugaya, Toshiyuki Asahi | 2008-07-01 |
| 7390692 | Semiconductor device and method for manufacturing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto | 2008-06-24 |
| 7365416 | Multi-level semiconductor module and method for fabricating the same | Takeshi Kawabata, Motoaki Satou, Toshiyuki Fukuda, Toshio Tsuda, Kazuhiro Nobori | 2008-04-29 |
| 7321496 | Flexible substrate, multilayer flexible substrate and process for producing the same | Yoshihisa Yamashita, Toshio Fujii, Takashi Ichiryu, Satoru Tomekawa, Hiroki Yabe | 2008-01-22 |
| 7319599 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor | Koichi Hirano, Tsunenori Yoshida | 2008-01-15 |
| 7294587 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu, Yoshiyuki Yamamoto | 2007-11-13 |
| 7258549 | Connection member and mount assembly and production method of the same | Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Tousaku Nishiyama, Koichi Hirano +3 more | 2007-08-21 |
| 7247178 | Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same | Koichi Hirano, Tsunenori Yoshida, Hiroyuki Handa, Yoshihisa Yamashita | 2007-07-24 |
| 7248482 | Module with built-in circuit component and method for producing the same | Toshiyuki Asahi, Yutaka Taguchi, Yasuhiro Sugaya, Toshio Fujii | 2007-07-24 |
| 7242823 | Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus | Seiji Karashima, Yasuhiro Sugaya, Toshiyuki Asahi, Takashi Ichiryu | 2007-07-10 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Satoru Tomekawa, Toshio Fujii +1 more | 2007-04-17 |
| 7198996 | Component built-in module and method for producing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu | 2007-04-03 |
| 7157789 | Semiconductor device and method for manufacturing the same | Koichi Hirano, Yoshiyuki Yamamoto, Toshiyuki Kojima, Shingo Komatsu | 2007-01-02 |
| 7141884 | Module with a built-in semiconductor and method for producing the same | Toshiyuki Kojima, Yasuhiro Sugaya, Yoshiyuki Yamamoto | 2006-11-28 |
| 7141874 | Electronic component packaging structure and method for producing the same | — | 2006-11-28 |
| 7140104 | Method of producing circuit component built-in module with embedded circuit component | Koichi Hirano, Hiroyuki Handa, Tsunenori Yoshida, Yoshihisa Yamashita, Hiroyuki Ishitomi | 2006-11-28 |
| 7134198 | Method for manufacturing electric element built-in module with sealed electric element | Yoshihiro Bessho, Yasuhiro Sugaya, Keiji Onishi | 2006-11-14 |
| 7132756 | Semiconductor device and method for manufacturing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto | 2006-11-07 |
| 7126811 | Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same | Koichi Hirano, Tsunenori Yoshida, Hiroyuki Handa, Yoshihisa Yamashita | 2006-10-24 |
| 7087467 | Lead frame and production process thereof and production process of thermally conductive substrate | Yoshihisa Yamashita, Koichi Hirano, Masaki Suzumura | 2006-08-08 |
| 7068519 | Printed circuit board and method manufacturing the same | Kouichi Hirano | 2006-06-27 |