Issued Patents All Time
Showing 101–125 of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7059042 | Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink | Koichi Hirano, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2006-06-13 |
| 7041535 | Power module and method of manufacturing the same | Yoshihisa Yamashita, Koichi Hirano | 2006-05-09 |
| 7038310 | Power module with improved heat dissipation | Koichi Hirano, Mitsuhiro Matsuo, Hiroyuki Handa | 2006-05-02 |
| 7033865 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Yoshihisa Yamashita, Koichi Hirano, Mitsuhiro Matsuo | 2006-04-25 |
| 7022276 | Method for manufacturing circuit board and circuit board and power conversion module using the same | Koichi Hirano, Yoshihisa Yamashita | 2006-04-04 |
| 7018866 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Satoru Yuhaku +1 more | 2006-03-28 |
| 7013561 | Method for producing a capacitor-embedded circuit board | Koichi Hirano, Mikinari Shimada, Yasuhiro Sugaya | 2006-03-21 |
| 7001662 | Transfer sheet and wiring board using the same, and method of manufacturing the same | Yasuhiro Sugaya, Hiroyuki Ishitomi | 2006-02-21 |
| 6975516 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu, Yoshiyuki Yamamoto | 2005-12-13 |
| 6958535 | Thermal conductive substrate and semiconductor module using the same | Koichi Hirano, Yoshihisa Yamashita | 2005-10-25 |
| 6955948 | Method of manufacturing a component built-in module | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu | 2005-10-18 |
| 6939738 | Component built-in module and method for producing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu | 2005-09-06 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-08-30 |
| 6931725 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Koichi Hirano, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2005-08-23 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-03-29 |
| 6870244 | Lead frame and production process thereof and production process of thermally conductive substrate | Yoshihisa Yamashita, Koichi Hirano, Masaki Suzumura | 2005-03-22 |
| 6863962 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2005-03-08 |
| 6860004 | Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink | Koichi Hirano, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2005-03-01 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Shingo Komatsu, Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto | 2005-02-15 |
| 6836401 | Capacitor, laminated capacitor, and capacitor built-in-board | Tsunenori Yoshida, Mikinari Shimada, Hiroyuki Handa, Masaaki Kuranuki, Akihiro Ishikawa | 2004-12-28 |
| 6818979 | High-frequency semiconductor device | Hideki Takehara, Noriyuki Yoshikawa, Kunihiko Kanazawa | 2004-11-16 |
| 6815810 | High-frequency semiconductor device | Hideki Takehara, Noriyuki Yoshikawa, Kunihiko Kanazawa | 2004-11-09 |
| 6798121 | Module with built-in electronic elements and method of manufacture thereof | Yoshihiro Bessho, Yasuhiro Sugaya, Keiji Onishi | 2004-09-28 |
| 6787884 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | Koichi Hirano, Hiroyuki Handa, Tsunenori Yoshida, Yoshihisa Yamashita, Hiroyuki Ishitomi | 2004-09-07 |
| 6784530 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Satoru Yuhaku +1 more | 2004-08-31 |