Issued Patents All Time
Showing 151–175 of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6108903 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same | Akihito Hatakeyama, Kouji Kawakita, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 2000-08-29 |
| 6096411 | Conductive paste composition for via hole filling and printed circuit board using the same | Kouji Kawakita, Tatsuo Ogawa | 2000-08-01 |
| 6060150 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2000-05-09 |
| 6045897 | Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same | Masayuki Sakai, Hideo Hatanaka, Masahide Tsukamoto, Masayuki Okano, Tamao Kojima | 2000-04-04 |
| 6038133 | Circuit component built-in module and method for producing the same | Kouichi Hirano | 2000-03-14 |
| 5977490 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1999-11-02 |
| 5972482 | Printed circuit board and method of manufacturing the same | Akihito Hatakeyama, Kouji Kawakita, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 1999-10-26 |
| 5960538 | Printed circuit board | Kouji Kawakita, Masahide Tsukamoto | 1999-10-05 |
| 5914358 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1999-06-22 |
| 5888627 | Printed circuit board and method for the manufacture of same | — | 1999-03-30 |
| 5858884 | Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same | Masayuki Sakai, Hideo Hatanaka, Masahide Tsukamoto, Masayuki Okano, Tamao Kojima | 1999-01-12 |
| 5817404 | Printed circuit board | Kouji Kawakita, Masahide Tsukamoto | 1998-10-06 |
| 5733467 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1998-03-31 |
| 5652042 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | Kouji Kawakita, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1997-07-29 |
| 5622590 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Keiji Saeki +1 more | 1997-04-22 |
| 5588207 | Method of manufacturing two-sided and multi-layered printed circuit boards | Kouji Kawakita, Masahide Tsukamoto, Yasukiho Horio, Akihito Hatakeyama | 1996-12-31 |
| 5550408 | Semiconductor device | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Keiji Saeki +1 more | 1996-08-27 |
| 5496619 | Assembly formed from conductive paste and insulating paste | Minehiro Itagaki, Kazuyuki Okano, Suzushi Kimura, Yoshihiro Bessho, Satoru Yuhaku +2 more | 1996-03-05 |
| 5484647 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same | Akihito Hatakeyama, Kouji Kawakita, Hirishi Sogou, Tatsuo Ogawa, Tamao Kojima | 1996-01-16 |
| 5440075 | Two-sided printed circuit board a multi-layered printed circuit board | Kouji Kawakita, Masahide Tsukamoto, Yasuhiko Horio, Akihito Hatakeyama | 1995-08-08 |
| 5436503 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Keiji Saeki +1 more | 1995-07-25 |
| 5407511 | Process for forming a sintered conductor circuit board | Masahide Tsukamoto, Mikinari Shimada | 1995-04-18 |
| 5406459 | Surface mounting module for an electric circuit board | Masahide Tsukamoto, Toru Ishida | 1995-04-11 |
| 5370759 | Method for producing multilayered ceramic substrate | Yasuhiko Hakotani, Tsuneharu Katada, Satoru Yuhaku, Kazuhiro Miura, Yoshifumi Nakamura | 1994-12-06 |
| 5252519 | Multilayered ceramic substrate and method of manufacturing the same | Tsutomu Nishimura, Satoru Yuhaku, Yasuhiko Hakotani | 1993-10-12 |