Issued Patents All Time
Showing 126–150 of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734542 | Component built-in module and method for producing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu | 2004-05-11 |
| 6707671 | Power module and method of manufacturing the same | Yoshihisa Yamashita, Koichi Hirano | 2004-03-16 |
| 6700182 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Yoshihisa Yamashita, Koichi Hirano, Mitsuhiro Matsuo | 2004-03-02 |
| 6692818 | Method for manufacturing circuit board and circuit board and power conversion module using the same | Koichi Hirano, Yoshihisa Yamashita | 2004-02-17 |
| 6666392 | Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same | Koichi Hirano, Hiroyuki Handa | 2003-12-23 |
| 6625037 | Printed circuit board and method manufacturing the same | Kouichi Hirano | 2003-09-23 |
| 6570099 | Thermal conductive substrate and the method for manufacturing the same | Koichi Hirano, Mitsuhiro Matsuo, Hiroyuki Handa, Yoshihisa Yamashita | 2003-05-27 |
| 6548152 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2003-04-15 |
| 6538210 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Koichi Hirano, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2003-03-25 |
| 6525921 | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same | Koichi Hirano, Mikinari Shimada, Yasuhiro Sugaya | 2003-02-25 |
| 6522555 | Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein | Koichi Hirano, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2003-02-18 |
| 6504705 | Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same | Mikinari Shimada, Yasuhiko Nakada, Seigo Shiraishi, Hiroyuki Handa, Akihiro Ishikawa | 2003-01-07 |
| 6489685 | Component built-in module and method of manufacturing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu | 2002-12-03 |
| 6486006 | Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection | Koichi Hirano | 2002-11-26 |
| 6473293 | Capacitor unit, method for producing the same, and solid electrolytic capacitor | Mikinari Shimada, Yasuhiko Nakada, Seigo Shiraishi, Hiroyuki Handa | 2002-10-29 |
| 6392525 | Magnetic element and method of manufacturing the same | Junichi Kato, Osamu Inoue, Koichi Hirano, Toshiyuki Asahi | 2002-05-21 |
| 6358351 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2002-03-19 |
| 6355131 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2002-03-12 |
| 6338767 | Circuit component built-in module and method for producing the same | Kouichi Hirano | 2002-01-15 |
| 6329045 | Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same | Koichi Hirano, Hiroyuki Handa | 2001-12-11 |
| 6326694 | Printed circuit board | Akihito Hatakeyama, Kouji Kawakita, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 2001-12-04 |
| 6300686 | Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection | Koichi Hirano | 2001-10-09 |
| 6211487 | Printed circuit board and method of manufacturing the same | Akihito Hatakeyama, Kouji Kawakita, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 2001-04-03 |
| 6205657 | Printed circuit board and method for producing the same | Yoshihiro Kawakita, Masakazu Tanahashi | 2001-03-27 |
| 6174589 | Printed circuit board and method for producing the same | Yoshihiro Kawakita, Masakazu Tanahashi | 2001-01-16 |