Issued Patents All Time
Showing 51–75 of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7905011 | Bump forming method and bump forming apparatus | Yasushi Taniguchi, Seiji Karashima, Takashi Kitae, Susumu Matsuoka, Masayoshi Koyama | 2011-03-15 |
| 7888789 | Transfer material used for producing a wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2011-02-15 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiji Karashima, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2011-01-25 |
| 7859855 | Module and mounted structure using the same | Tsutomu Mitani | 2010-12-28 |
| 7851281 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Shingo Komatsu, Yoshihisa Yamashita, Takashi Ichiryu | 2010-12-14 |
| 7850803 | Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film | Tsukasa Shiraishi | 2010-12-14 |
| 7820021 | Flip chip mounting method and method for connecting substrates | Seiji Karashima, Takashi Kitae | 2010-10-26 |
| 7799607 | Process for forming bumps and solder bump | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae | 2010-09-21 |
| 7773386 | Flexible substrate, multilayer flexible substrate | Yoshihisa Yamashita, Toshio Fujii, Takashi Ichiryu, Satoru Tomekawa, Hiroki Yabe | 2010-08-10 |
| 7759162 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae | 2010-07-20 |
| 7748110 | Method for producing connection member | Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Tousaku Nishiyama, Koichi Hirano +3 more | 2010-07-06 |
| 7732920 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima | 2010-06-08 |
| 7726545 | Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei | Takashi Ichiryu, Seiji Karashima, Yoshihiro Tomita, Koichi Hirano, Toshio Fujii | 2010-06-01 |
| 7714444 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiji Karashima, Takashi Kitae, Susumu Sawada | 2010-05-11 |
| 7713787 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Yoshihisa Yamashita, Takashi Kitae, Shingo Komatsu | 2010-05-11 |
| 7689129 | System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission line | Seiji Karashima, Yoshiyuki Saito | 2010-03-30 |
| 7667974 | Module and mounted structure using the same | Tsutomu Mitani | 2010-02-23 |
| 7640659 | Method for forming conductive pattern and wiring board | Seiji Karashima, Takashi Kitae | 2010-01-05 |
| 7640654 | Electronic component transporting method | Seiji Karashima, Takashi Kitae | 2010-01-05 |
| 7638883 | Flip chip mounting method and bump forming method | Seiji Karashima, Takashi Kitae | 2009-12-29 |
| 7611040 | Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition | Takashi Kitae, Toshiyuki Kojima, Shingo Komatsu, Yoshihisa Yamashita | 2009-11-03 |
| 7586183 | Multilevel semiconductor module and method for fabricating the same | Takeshi Kawabata, Motoaki Satou, Toshiyuki Fukuda, Toshio Tsuda, Kazuhiro Nobori | 2009-09-08 |
| 7537961 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiji Karashima, Takashi Kitae, Susumu Sawada | 2009-05-26 |
| 7531754 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Satoru Tomekawa, Toshio Fujii +1 more | 2009-05-12 |
| 7531387 | Flip chip mounting method and bump forming method | Seiji Karashima, Takashi Kitae | 2009-05-12 |