Issued Patents All Time
Showing 51–75 of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8387240 | Methods for making multi-chip packaging using an interposer | Sriram Muthukumar, Raul Mancera, Chi Won Hwang | 2013-03-05 |
| 8354748 | In-package microelectronic apparatus, and methods of using same | Sriram Dattaguru, Lesley A. Polka Wood, Kiniya Ichikawa, Robert L. Sankman | 2013-01-15 |
| 8227907 | Flexible interconnect pattern on semiconductor package | David Chau, Gregory M. Chrysler, Devendra Natekar | 2012-07-24 |
| 8134231 | Semiconductor chip and semiconductor device | Hikari Sano, Takahiro Nakano | 2012-03-13 |
| 8110920 | In-package microelectronic apparatus, and methods of using same | Sriram Dattaguru, Lesley A. Polka Wood, Kinya Ichikawa, Robert L. Sankman | 2012-02-07 |
| 8077900 | Microphone and method for fabricating the same | Masanori Minamio, Koji Nomura | 2011-12-13 |
| 7993980 | Lead frame, electronic component including the lead frame, and manufacturing method thereof | Toshiyuki Fukuda, Hisashi Umeda, Yasutake Yaguchi | 2011-08-09 |
| 7971347 | Method of interconnecting workpieces | Leonel Arana, Rob Nickerson, Lim Chong Sim, Edward R. Prack | 2011-07-05 |
| 7973412 | Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead | Seiji Fujiwara, Akio Furusawa, Kenichirou Suetugu | 2011-07-05 |
| 7960271 | Semiconductor device and method of manufacturing the same | Hideki Takehara, Seiji Fujiwara, Takahiro Nakano, Hikari Sano | 2011-06-14 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani | 2011-04-19 |
| 7915697 | Sensor device and fabrication method for the same | Masanori Minamio | 2011-03-29 |
| 7915081 | Flexible interconnect pattern on semiconductor package | David Chau, Gregory M. Chrysler, Devendra Natekar | 2011-03-29 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Koichi Hirano, Seiji Karashima, Takashi Ichiryu | 2011-03-22 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Raul Mancera, Chi Won Hwang | 2011-02-08 |
| 7868336 | Semiconductor device and method of manufacturing the same | Hiroaki Fujimoto | 2011-01-11 |
| 7841080 | Multi-chip packaging using an interposer with through-vias | Sriram Muthukumar, Raul Mancera, Chi Won Hwang | 2010-11-30 |
| 7790270 | Wiring board and semiconductor device | Masanori Minamio, Toshiyuki Fukuda | 2010-09-07 |
| 7754529 | Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Toshio Fujii | 2010-07-13 |
| 7726545 | Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei | Takashi Ichiryu, Seiichi Nakatani, Seiji Karashima, Koichi Hirano, Toshio Fujii | 2010-06-01 |
| 7638884 | Thin semiconductor device package | James Jackson, Damion Searls | 2009-12-29 |
| 7522938 | Portable information terminal apparatus | Yasushi Nakagiri, Tsuguhiro Korenaga, Kunio Hibino, Seiji Karashima, Satoru Tomekawa | 2009-04-21 |
| 7517732 | Thin semiconductor device package | James Jackson, Damion Searls | 2009-04-14 |
| 7514116 | Horizontal Carbon Nanotubes by Vertical Growth and Rolling | Devendra Natekar, Chi Won Hwang | 2009-04-07 |
| 7359416 | Optical semiconductor device | Noriyuki Yoshikawa, Masanori Minamio, Hisanori Ishiguro, Hideyuki Nakanishi, Hiroyuki Ishida +1 more | 2008-04-15 |