Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure | Kenichi Hayashi, Hisashi Kawafuji, Junichi Murai | 2008-04-22 |
| 5950908 | Solder supplying method, solder supplying apparatus and soldering method | Junji Fujino, Jitsuho Hirota, Akira Adachi | 1999-09-14 |
| 5821762 | Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate | Tsuneo Hamaguchi, Kenji Kagata, Mitsunori Ishizaki, Osamu Hayashi, Susumu Hoshinouchi | 1998-10-13 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Shunichi Abe, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi +2 more | 1997-03-11 |