Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255080 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device | Takamasa Iwai, Yuichiro Suzuki, Akitoshi Shirao, Akira Kosugi | 2025-03-18 |
| 12183647 | Packaging of a semiconductor device with dual sealing materials | Soichi Sakamoto, Hiroshi Kawashima, Taketoshi MAEDA | 2024-12-31 |
| 12087651 | Semiconductor device and method of manufacturing the same | Kazuma Noda, Satoshi Kondo, Michio Ogawa | 2024-09-10 |
| 12062883 | Semiconductor module and method of manufacturing same | Yutaka Yoneda, Tadayoshi Hata, Jin Sato | 2024-08-13 |
| 11631623 | Power semiconductor device and method of manufacturing the same, and power conversion device | Takamasa Iwai, Hiroshi Kawashima | 2023-04-18 |
| 11562979 | Power module and method of manufacturing the same, and power conversion apparatus | Chika MATSUI, Satoshi Kondo, Masao Uchigasaki | 2023-01-24 |
| 11557531 | Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device | Shohei Ogawa, Yusuke ISHIYAMA, Isao Oshima, Takumi Shigemoto | 2023-01-17 |
| 11538728 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | Soichi Sakamoto, Katsumi Miyawaki, Hiroaki Ichinohe | 2022-12-27 |
| 11424178 | Semiconductor module | Satoshi Kondo, Hidetoshi Ishibashi, Hiroshi Yoshida, Nobuhiro Asaji, Yusuke ISHIYAMA +1 more | 2022-08-23 |
| 11398447 | Semiconductor device and method for producing semiconductor device | Shohei Ogawa, Satoru Ishikawa, Takumi Shigemoto, Yusuke ISHIYAMA | 2022-07-26 |
| 11239123 | Semiconductor module, semiconductor device, and vehicle | Tatsuya Kawase, Noboru Miyamoto, Mikio Ishihara, Yuji IMOTO, Naoki Yoshimatsu | 2022-02-01 |
| 11183479 | Semiconductor device, method for manufacturing the same, and power conversion device | Shohei Ogawa, Isao Oshima, Satoru Ishikawa, Takumi Shigemoto | 2021-11-23 |
| 11004761 | Packaging of a semiconductor device with dual sealing materials | Soichi Sakamoto, Hiroshi Kawashima, Taketoshi MAEDA | 2021-05-11 |
| 10978366 | Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module | Yuji IMOTO, Shohei Ogawa, Mikio Ishihara | 2021-04-13 |
| 10727163 | Semiconductor device | Yuji IMOTO, Shohei Ogawa, Mikio Ishihara | 2020-07-28 |
| 10658284 | Shaped lead terminals for packaging a semiconductor device for electric power | Mikio Ishihara, Masayoshi Shinkai, Hiroyuki Harada | 2020-05-19 |
| 10559538 | Power module | Shohei Ogawa, Soichi Sakamoto | 2020-02-11 |
| 10431528 | Semiconductor device | Takamasa Iwai, Satoshi Kondo, Hiroshi Kawashima, Ken Sakamoto | 2019-10-01 |
| 10204886 | Semiconductor device | Hiroshi Yoshida, Yuji IMOTO, Hidetoshi Ishibashi, Daisuke Murata, Kenta NAKAHARA +2 more | 2019-02-12 |
| 10096570 | Manufacturing method for power semiconductor device, and power semiconductor device | Yutaka Yoneda, Kazuyoshi Shige, Yoichi HIRONAKA | 2018-10-09 |
| 9917064 | Semiconductor device with a plate-shaped lead terminal | Yusuke ISHIYAMA, Yuji IMOTO, Shinsuke Asada, Mikio Ishihara | 2018-03-13 |
| 9899345 | Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power | Yutaka Yoneda, Shohei Ogawa, Soichi Sakamoto, Mikio Ishihara, Miho Nagai | 2018-02-20 |
| 9818716 | Power module | Yoshihisa UCHIDA, Shohei Ogawa, Soichi Sakamoto, Tatsunori YANAGIMOTO | 2017-11-14 |
| 9698091 | Power semiconductor device | Shinsuke Asada, Naoki Yoshimatsu, Yuji IMOTO, Yusuke ISHIYAMA | 2017-07-04 |
| 9691730 | Semiconductor device and method for manufacturing the same | Naoki Yoshimatsu, Yusuke ISHIYAMA, Taketoshi Shikano, Yuji IMOTO, Shinsuke Asada | 2017-06-27 |