Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901326 | Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device | Satoru Ishikawa, Yuki YANO, Shohei Ogawa, Kiyoshi Arai | 2024-02-13 |
| 10573570 | Semiconductor device and power conversion device | Daisuke Murata, Hiroshi Yoshida, Satoshi Kondo, Yusuke Kaji | 2020-02-25 |
| 10388581 | Semiconductor device having press-fit terminals disposed in recesses in a case frame | Hidetoshi Ishibashi, Yoshitaka Kimura, Minoru Egusa | 2019-08-20 |
| 9917064 | Semiconductor device with a plate-shaped lead terminal | Yusuke ISHIYAMA, Yuji IMOTO, Junji Fujino, Mikio Ishihara | 2018-03-13 |
| 9698091 | Power semiconductor device | Naoki Yoshimatsu, Yuji IMOTO, Yusuke ISHIYAMA, Junji Fujino | 2017-07-04 |
| 9691730 | Semiconductor device and method for manufacturing the same | Naoki Yoshimatsu, Yusuke ISHIYAMA, Taketoshi Shikano, Yuji IMOTO, Junji Fujino | 2017-06-27 |
| 9129949 | Power semiconductor module | Kenjiro Nagao, Dai Nakajima, Yuetsu Watanabe, Yoshihito Asao, Takuya Oga +1 more | 2015-09-08 |
| 8749977 | Power semiconductor module and its attachment structure | Yuetsu Watanabe, Yoshihito Asao, Kenjiro Nagao | 2014-06-10 |
| 8597755 | Resin welded body and manufacturing method thereof | Seizo Fujimoto, Takafumi Hara, Hiroshi Kobayashi, Masaaki Taruya | 2013-12-03 |
| 8110062 | Welding method and welding apparatus for resin member | Takafumi Hara, Seizo Fujimoto, Masaaki Taruya | 2012-02-07 |
| 7862874 | Welded resin material | Takafumi Hara, Seizo Fujimoto, Masaaki Taruya | 2011-01-04 |
| 7603908 | Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor | Hiroshi Nakamura, Masaaki Taruya | 2009-10-20 |
| 7412895 | Semiconductor pressure sensor and die for molding a semiconductor pressure sensor | Hiroshi Nakamura, Masaaki Taruya | 2008-08-19 |
| 7391101 | Semiconductor pressure sensor | Yoshimitsu Takahata, Hiroshi Nakamura, Masaaki Taruya | 2008-06-24 |