Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742251 | Power semiconductor device including press-fit connection terminal | Hidetoshi Ishibashi, Yoshitaka Kimura, Nobuhiro Asaji, Kazunari Teshigawara | 2023-08-29 |
| 11631653 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | Shingo Sudo, Kazuyuki Hashimoto, Erubi SUZUKI | 2023-04-18 |
| 10388581 | Semiconductor device having press-fit terminals disposed in recesses in a case frame | Hidetoshi Ishibashi, Shinsuke Asada, Yoshitaka Kimura | 2019-08-20 |
| 9979105 | Power semiconductor device | Hidetoshi Ishibashi, Yoshitaka Otsubo, Hiroyuki MASUMOTO, Hiroshi Kawata | 2018-05-22 |
| 9887142 | Power semiconductor device | Kazuyoshi Shige | 2018-02-06 |
| 9640453 | Power semiconductor device | Kazuyoshi Shige | 2017-05-02 |