Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631653 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | Minoru Egusa, Shingo Sudo, Kazuyuki Hashimoto | 2023-04-18 |
| 10872877 | Method of manufacturing semiconductor device | — | 2020-12-22 |