Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300569 | Semiconductor device | Masanori Tsukuda, Koichi Nishi, Shinya SONEDA, Koji Tanaka, Norikazu Sakai | 2025-05-13 |
| 11735509 | Power semiconductor device and manufacturing method thereof | Keitaro ICHIKAWA, Yuji SHIKASHO, Fumihito KAWAHARA | 2023-08-22 |
| 11387173 | Method for manufacturing semiconductor device | Ken Sakamoto, Hiroshi Kawashima | 2022-07-12 |
| 11107746 | Power semiconductor apparatus and manufacturing method therefor | Hiroshi Kawashima, Takamasa Iwai, Satoshi Kondo, Ken Sakamoto | 2021-08-31 |
| 10541193 | Lead frame and method for manufacturing semiconductor device | Ken Sakamoto, Hiroshi Kawashima | 2020-01-21 |
| 10104775 | Semiconductor device and method for manufacturing the same | Naoki Yoshimatsu, Masayoshi Shinkai, Daisuke Murata, Nobuyoshi Kimoto, Yuji IMOTO +1 more | 2018-10-16 |
| 9947613 | Power semiconductor device and method for manufacturing the same | Hiroshi Kawashima, Ken Sakamoto, Satoshi Kondo, Yoshihiro Takai, Claudio Feliciani | 2018-04-17 |
| 9716072 | Power semiconductor device and method of manufacturing the same | Hiroshi Kawashima, Ken Sakamoto | 2017-07-25 |
| 9691730 | Semiconductor device and method for manufacturing the same | Naoki Yoshimatsu, Yusuke ISHIYAMA, Yuji IMOTO, Junji Fujino, Shinsuke Asada | 2017-06-27 |
| 9627302 | Power semiconductor device | Keitaro ICHIKAWA | 2017-04-18 |
| 9466548 | Semiconductor device and method of manufacturing semiconductor device | Ken Sakamoto, Taishi Sasaki | 2016-10-11 |
| 9437460 | Method for manufacturing semiconductor device | Naoki Yoshimatsu, Kiyohiro Uchida, Masayoshi Shinkai | 2016-09-06 |
| 9171772 | Semiconductor device | — | 2015-10-27 |
| 8518751 | Method for manufacturing semiconductor device including removing a resin burr | Ken Sakamoto, Mitsugu Tanaka, Taishi Sasaki | 2013-08-27 |
| 8334176 | Method of manufacturing semiconductor device | Ken Sakamoto | 2012-12-18 |
| 8183094 | Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion | — | 2012-05-22 |
| 7855464 | Semiconductor device having a semiconductor chip and resin sealing portion | — | 2010-12-21 |
| 7151311 | Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer | Dai Nakajima, Kazuhiro Tada, Yasunari HINO | 2006-12-19 |
| 6791167 | Resin-molded device and manufacturing apparatus thereof | Kenichi Hayashi, Hisashi Kawafuji, Mitsugu Tajiri | 2004-09-14 |
| 6753596 | Resin-sealed semiconductor device | Dai Nakajima, Kiyoshi Ishida | 2004-06-22 |