Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183647 | Packaging of a semiconductor device with dual sealing materials | Junji Fujino, Hiroshi Kawashima, Taketoshi MAEDA | 2024-12-31 |
| 11538728 | Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier | Junji Fujino, Katsumi Miyawaki, Hiroaki Ichinohe | 2022-12-27 |
| 11004761 | Packaging of a semiconductor device with dual sealing materials | Junji Fujino, Hiroshi Kawashima, Taketoshi MAEDA | 2021-05-11 |
| 10559538 | Power module | Junji Fujino, Shohei Ogawa | 2020-02-11 |
| 9899345 | Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power | Junji Fujino, Yutaka Yoneda, Shohei Ogawa, Mikio Ishihara, Miho Nagai | 2018-02-20 |
| 9818716 | Power module | Junji Fujino, Yoshihisa UCHIDA, Shohei Ogawa, Tatsunori YANAGIMOTO | 2017-11-14 |