Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183647 | Packaging of a semiconductor device with dual sealing materials | Soichi Sakamoto, Junji Fujino, Hiroshi Kawashima | 2024-12-31 |
| 11004761 | Packaging of a semiconductor device with dual sealing materials | Soichi Sakamoto, Junji Fujino, Hiroshi Kawashima | 2021-05-11 |