Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6768062 | Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof | Ryoichi Morimoto, Tatsuya Funaki | 2004-07-27 |
| 6598779 | Electronic component mounting method | Ryoichi Morimoto | 2003-07-29 |
| 5950908 | Solder supplying method, solder supplying apparatus and soldering method | Junji Fujino, Goro Izuta, Akira Adachi | 1999-09-14 |
| 5302550 | Method of bonding a microelectronic device | Kazumichi Machida, Masaaki Shimotomai, Seizo Omae | 1994-04-12 |
| 4739142 | Method of producing a wire bonding ball | Kazumichi Machida, Masaaki Shimotomai | 1988-04-19 |
| 4705204 | Method of ball forming for wire bonding | Kazumichi Machida, Noriko Watanabe | 1987-11-10 |