Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385007 | Method for producing fibrin sheet | Takaaki Samura, Yoshiki Sawa, Junya YOKOYAMA | 2025-08-12 |
| 12226436 | Transplant material for treatment of heart disease | Daisuke Kajita, Satsuki Fukushima, Yoshiki Sawa | 2025-02-18 |
| 12127553 | Cell cryopreservation composition and cryopreservation method | Asuka Nogami, Motoki Tatsumi, Nanase Ishii, Mizuyuki Ryu, Yoshihiko Hirata +3 more | 2024-10-29 |
| 12084683 | Method for increasing the proportion of desired cells from induced pluripotent stem cells | Fumiya OHASHI, Hiroko Iseoka, Yoshiki Sawa | 2024-09-10 |
| 11969459 | Therapeutic agent for cardiomyopathy, old myocardial infarction and chronic heart failure | Katsuto Tamai, Yoshiki Sawa, Takashi Kido, Takasumi Goto, Takehiko Yamazaki | 2024-04-30 |
| 11441115 | Cell culture device | Taro Nagai, Yoshiki Sawa, Kenji Oyama | 2022-09-13 |
| 11124770 | Myocardial cell sheet | Hiroko Iseoka, Yoshiki Sawa, Satsuki Fukushima | 2021-09-21 |
| 10696948 | Method for preparing pluripotent stem cell-derived cardiomyocyte population | Yukiko Ochi, Kiyotoshi Sekiguchi, Yoshiki Sawa, Antti Markus Siltanen | 2020-06-30 |
| 9968716 | Drug-eluting stent graft | Yoshiki Sawa, Toru Kuratani, Koichi Toda, Takayoshi Ueno, Satsuki Fukushima +3 more | 2018-05-15 |
| 9737636 | Method for producing laminate of sheet-shaped cell culture and fibrin gel | Fumiya OOHASHI, Ryouhei TAKEUCHI, Tadashi SAMESHIMA, Yoshiki Sawa, Atsuhiro Saito | 2017-08-22 |
| 9623078 | Method for treating cardiac infarction using HMGB1 fragment | Katsuto Tamai, Sokichi Kamata, Yasufumi Kaneda, Yoshiki Sawa, Takehiko Yamazaki | 2017-04-18 |
| 9597436 | Advanced heart failure treatment material as myocardial/cardiovascular regeneration device | Yoshiki Sawa, Satsuki Fukushima, Atsuhiro Saito, Yoshiki Sakai, Kazuhisa Matsuda +1 more | 2017-03-21 |
| 9587222 | Three-dimensional tissue structure | Hikaru Matsuda, Yoshiki Sawa, Satoshi Taketani | 2017-03-07 |
| 6346433 | Method of coating semiconductor wafer with resin and mold used therefor | Keiji Maeda | 2002-02-12 |