Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8231046 | Wire bonding apparatus and wire bonding method | Mitsuhiro Nakao, Junya Sagara, Katsuhiro Ishida | 2012-07-31 |
| 7569921 | Semiconductor device and manufacturing method thereof | Ryoji Matsushima, Kazuhiro Yamamori, Junya Sagara, Yoshio Iizuka, Kuniyuki Ohnishi | 2009-08-04 |