Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7060593 | Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer | Shinya Takyu | 2006-06-13 |
| 7060532 | Manufacturing method of semiconductor device | Shinya Takyu, Kinya Mochida, Kenichi Watanabe | 2006-06-13 |
| 6933606 | Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same | — | 2005-08-23 |
| 6933211 | Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same | — | 2005-08-23 |
| 6777313 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Shinya Takyu, Mika Kiritani, Terunari Takano | 2004-08-17 |
| 6774011 | Chip pickup device and method of manufacturing semiconductor device | Takahito Nakazawa, Hideo Numata, Shinya Takyu | 2004-08-10 |
| 6756562 | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method | Shinya Takyu, Ninao Sato | 2004-06-29 |
| 6739326 | Semiconductor manufacturing equipment | Hideo Numata, Keisuke Tokubuchi | 2004-05-25 |
| 6709543 | Semiconductor chip pickup device and pickup method | — | 2004-03-23 |
| 6699774 | Wafer splitting method using cleavage | Shinya Takyu | 2004-03-02 |
| 6555418 | Method for separating a semiconductor element in a semiconductor element pushing-up device | Shigeo Sasaki | 2003-04-29 |
| 6352073 | Semiconductor manufacturing equipment | Hideo Numata, Keisuke Tokubuchi | 2002-03-05 |
| 6337258 | Method of dividing a wafer | Hideo Nakayoshi, Shinya Takyu, Keisuke Tokubuchi | 2002-01-08 |
| 6201306 | Push-up pin of a semiconductor element pushing-up device, and a method for separating | Shigeo Sasaki | 2001-03-13 |