Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170352 | Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor device | Shuji Itonaga, Hideto Furuyama | 2019-01-01 |
| 9887328 | Semiconductor light emitting device and method for manufacturing same | Hideyuki Tomizawa, Akihiro Kojima, Miyoko Shimada, Yosuke Akimoto, Hideko Mukaida +5 more | 2018-02-06 |
| 9755127 | Semiconductor light emitting device and method for manufacturing same | Miyuki Shimojuku, Hideto Furuyama, Shuji Itonaga, Yukihiro Nomura, Akihiro Kojima | 2017-09-05 |
| 9735325 | Semiconductor device and manufacturing method of semiconductor device | — | 2017-08-15 |
| 9595631 | Semiconductor light emitting device and method of manufacturing the same | Shuji Itonaga, Miyuki Shimojuku, Yukihiro Nomura, Hideto Furuyama | 2017-03-14 |
| 9543484 | Semiconductor light emitting device and method for manufacturing same | Shuji Itonaga, Miyuki Shimojuku, Yukihiro Nomura, Hideto Furuyama | 2017-01-10 |
| 9312207 | Semiconductor device | Satoshi Wakatsuki, Atsuko Sakata, Kengo Uchida, Kazuyuki Higashi | 2016-04-12 |
| 9229052 | Stack including inspection circuit, inspection method and inspection apparatus | — | 2016-01-05 |
| 9209097 | Substrate bonding method and substrate bonding apparatus | — | 2015-12-08 |
| 9123717 | Semiconductor device manufacturing method and manufacturing apparatus | Kenro Nakamura, Kazuyuki Higashi, Takashi Shirono | 2015-09-01 |
| 8884396 | Semiconductor device and manufacturing method thereof | — | 2014-11-11 |
| 8766407 | Semiconductor wafer and laminate structure including the same | — | 2014-07-01 |
| 8427808 | Variable capacity element | — | 2013-04-23 |
| 8324715 | Semiconductor device and method of manufacturing the same | — | 2012-12-04 |
| 7768456 | Antenna device and radio communication device | Yukako Tsutsumi, Mitsuhiro Nakao | 2010-08-03 |
| 7370412 | Method for connecting electronic device | Toshiro Hiraoka, Naoko Yamaguchi, Yasuyuki Hotta, Shigeru Matake, Hideo Aoki +1 more | 2008-05-13 |
| 7095112 | Semiconductor device, semiconductor package member, and semiconductor device manufacturing method | Mie Matsuo, Chiaki Takubo | 2006-08-22 |
| 6861738 | Laminated-chip semiconductor device | Katsuhiko Oyama, Chiaki Takubo, Takashi Yamazaki, Takashi Imoto | 2005-03-01 |
| 6617678 | Semiconductor device | Takashi Yamazaki, Chiaki Takubo, Katsuhiko Oyama, Takashi Imoto, Mikio Matsui | 2003-09-09 |
| 5969413 | Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads | Keiichi Yano, Kazuo Kimura, Hironori Asai, Jun Monma, Koji Yamakawa +1 more | 1999-10-19 |
| 5703397 | Semiconductor package having an aluminum nitride substrate | Hironori Asai, Keiichi Yano, Yoshitoshi Sato | 1997-12-30 |
| 5176309 | Method of manufacturing circuit board | Akihiro Horiguchi, Mitsuo Kasori, Fumio Ueno, Hiroshi Komorita | 1993-01-05 |
| 4770953 | Aluminum nitride sintered body having conductive metallized layer | Akihiro Horiguchi, Mituo Kasori, Fumio Ueno, Hideki Sato, Nobuyuki Mizunoya +2 more | 1988-09-13 |