Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5969413 | Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads | Keiichi Yano, Kazuo Kimura, Hironori Asai, Koji Yamakawa, Mitsuyoshi Endo +1 more | 1999-10-19 |
| 5928769 | Aluminum nitride wiring substrate and method for production thereof | Hironori Asai | 1999-07-27 |
| 5804288 | Aluminum nitride wiring substrate | — | 1998-09-08 |
| 5641718 | Sintered aluminum nitride and circuit substrate using sintered aluminum nitride | Akihiro Horiguchi, Katsuyoshi Oh-Ishi, Mitsuo Kasori, Hiroyasu Sumino, Fumio Ueno +1 more | 1997-06-24 |
| 5616956 | Circuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing same | Akihiro Horiguchi, Kazuo Kimura, Katsuyoshi Oh-Ishi, Fumio Ueno, Mitsuo Kasori +1 more | 1997-04-01 |