HA

Hironori Asai

KT Kabushiki Kaisha Toshiba: 21 patents #1,382 of 21,451Top 7%
Overall (All Time): #196,970 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8974697 Luminescent material Keiko Albessard, Masahiro Kato, Yumi Fukuda, Iwao Mitsuishi, Takahiro Sato +6 more 2015-03-10
8896076 Photoelectric conversion element, photoelectric conversion system, and method for production of photoelectric conversion element Shinji Saito, Rei Hashimoto, Mizunori Ezaki, Shinya Nunoue 2014-11-25
8685277 Fluorescent substance and light-emitting device employing the same Yumi Fukuda 2014-04-01
8603361 Fluorescent substance and light-emitting device employing the same Yumi Fukuda 2013-12-10
8491817 Luminescent material and light-emitting device Yumi Fukuda, Masaaki Tamatani, Ryosuke Hiramatsu, Junichi Tatami, Katsutoshi Komeya +1 more 2013-07-23
8482192 Luminescent material and light-emitting device Yumi Fukuda, Masaaki Tamatani, Ryosuke Hiramatsu, Junichi Tatami, Katsutoshi Komeya +1 more 2013-07-09
8475680 Luminescent material and light-emitting device Yumi Fukuda, Masaaki Tamatani, Ryosuke Hiramatsu, Junichi Tatami, Katsutoshi Komeya +1 more 2013-07-02
8450923 Luminescent material and light-emitting device Yumi Fukuda, Masaaki Tamatani, Ryosuke Hiramatsu, Junichi Tatami, Katsutoshi Komeya +1 more 2013-05-28
8105502 Luminescent material Yumi Fukuda, Jun-ichi Tatami, Katsutoshi Komeya, Naotoshi Matsuda, Toru Wakihara +2 more 2012-01-31
7638934 Fluorescent substance and light-emitting device Yumi Fukuda, Masaaki Tamatani, Naotoshi Matsuda, Ryosuke Hiramatsu, Keiko Albessard +3 more 2009-12-29
7498736 Luminescent material Ryosuke Hiramatsu, Masaaki Tamatani, Kazuaki Ootsuka 2009-03-03
6881115 Electron emitting device and method of manufacturing the same Masahiko Yamamoto, Yoshiki Ishizuka, Yumi Fukuda, Koji Suzuki 2005-04-19
6445124 Field emission device Masahiko Yamamoto, Koji Suzuki 2002-09-03
6046499 Heat transfer configuration for a semiconductor device Keiichi Yano 2000-04-04
5969413 Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads Keiichi Yano, Kazuo Kimura, Jun Monma, Koji Yamakawa, Mitsuyoshi Endo +1 more 1999-10-19
5928769 Aluminum nitride wiring substrate and method for production thereof Jun Monma 1999-07-27
5909058 Semiconductor package and semiconductor mounting part Keiichi Yano, Kaoru Koiwa, Nobuo Iwase 1999-06-01
5736790 Semiconductor chip, package and semiconductor device Kiyoshi Iyogi, Kaoru Koiwa, Keiichi Yano 1998-04-07
5703397 Semiconductor package having an aluminum nitride substrate Mitsuyoshi Endo, Keiichi Yano, Yoshitoshi Sato 1997-12-30
5637406 Metallized aluminum nitride substrate Yasuyuki Sugiura 1997-06-10
5063121 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Hideki Sato, Nobuyuki Mizunoya, Kazuo Anzai, Tsuyoshi Hatano 1991-11-05
4883704 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Hideki Sato, Nobuyuki Mizunoya, Kazuo Anzai, Tsuyoshi Hatano 1989-11-28