Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426154 | Ceramic circuit board | Takayuki Naba, Hiroshi Komorita, Noritaka Nakayama | 2002-07-30 |
| 5907187 | Electronic component and electronic component connecting structure | Kaoru Koiwa, Koji Yamakawa, Takaaki Yasumoto, Nobuo Iwase | 1999-05-25 |
| 5736790 | Semiconductor chip, package and semiconductor device | Kaoru Koiwa, Keiichi Yano, Hironori Asai | 1998-04-07 |
| 5714801 | Semiconductor package | Keiichi Yano, Jun Kudo, Koji Yamakawa | 1998-02-03 |
| 5622769 | Ceramic circuit board having a thermal conductivity substrate | Shoji Kozuka, Masaru Hayashi, Katsuyoshi Oh-Ishi, Takaaki Yasumoto, Nobuo Iwase +3 more | 1997-04-22 |
| 5412160 | Circuit board | Takaaki Yasumoto, Nobuo Iwase, Kaoru Koiwa, Koji Yamakawa | 1995-05-02 |
| 5326623 | Circuit board | Koji Yamakawa, Kaoru Koiwa, Takaaki Yasumoto, Nobuo Iwase | 1994-07-05 |
| 5041700 | Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure | Takaaki Yasumoto, Toshirou Yanazawa, Nobuo Iwase | 1991-08-20 |
| 5019187 | Brazing paste for bonding metal and ceramic | Masako Nakahashi, Hiromitsu Takeda, Makoto Shirokane | 1991-05-28 |
| 4924033 | Brazing paste for bonding metal and ceramic | Masako Nakahashi, Hiromitsu Takeda, Makoto Shirokane | 1990-05-08 |
| 4919731 | Brazing paste | Takaaki Yasumoto, Toshirou Yanazawa, Nobuo Iwase, Masako Nakahashi, Hiromitsu Takeda | 1990-04-24 |
| 4855251 | Method of manufacturing electronic parts including transfer of bumps of larger particle sizes | Koji Yamakawa, Nobuo Iwase | 1989-08-08 |
| 4835344 | Electronic component parts and method for manufacturing the same | Takaaki Yasumoto, Toshirou Yanazawa, Nobuo Iwase, Masako Nakahashi, Hiromitsu Takeda | 1989-05-30 |
| 4659611 | Circuit substrate having high thermal conductivity | Nobuo Iwase, Kazuo Anzai, Kazuo Shinozaki, Akihiko Tsuge, Kazutaka Saitoh +2 more | 1987-04-21 |