HK

Hiroshi Komorita

KT Kabushiki Kaisha Toshiba: 19 patents #1,558 of 21,451Top 8%
TC Toshiba Materials Co.: 1 patents #127 of 197Top 65%
Overall (All Time): #239,487 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
9356101 Polycrystalline aluminum nitride base material for crystal growth of GaN-base semiconductor and method for manufacturing GaN-base semiconductor using the same Noritaka Nakayama, Kentaro Takanami 2016-05-31
7263766 Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate Yutaka Ishiwata, Kosoku Nagata, Toshio Shimizu, Hiroyuki Hiramoto, Yasuhiko Taniguchi +2 more 2007-09-04
6784131 Silicon nitride wear resistant member and method of manufacturing the member Michiyasu Komatsu, Hiroki Tonai 2004-08-31
6605868 Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer Yutaka Ishiwata, Kosoku Nagata, Toshio Shimizu, Hiroyuki Hiramoto, Yasuhiko Taniguchi +2 more 2003-08-12
6485830 Material for ceramic ball and method of manufacturing ceramic ball Minoru Takao, Isao Ikeda, Hiroki Tonai 2002-11-26
6426154 Ceramic circuit board Takayuki Naba, Noritaka Nakayama, Kiyoshi Iyogi 2002-07-30
6232657 Silicon nitride circuit board and semiconductor module Kazuo Ikeda, Michiyasu Komatsu, Yoshitoshi Sato, Takayuki Naba 2001-05-15
6040039 Silicon nitride circuit board Kazuo Ikeda, Yoshitoshi Sato, Michiyasu Komatsu, Nobuyuki Mizunoya 2000-03-21
5998000 Silicon nitride circuit board Kazuo Ikeda, Yoshitoshi Sato, Michiyasu Komatsu, Nobuyuki Mizunoya 1999-12-07
5928768 Silicon nitride circuit board Kazuo Ikeda, Yoshitoshi Sato, Michiyasu Komatsu, Nobuyuki Mizunoya 1999-07-27
5672848 Ceramic circuit board Tadashi Tanaka, Takayuki Naba, Takashi Hino 1997-09-30
5363278 Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof Nobuyuki Mizunoya 1994-11-08
5328751 Ceramic circuit board with a curved lead terminal Nobuyuki Mizunoya, Kazuo Matsumura, Kazuo Ikeda, Takayuki Naba, Tadashi Tanaka 1994-07-12
5280850 Method of manufacturing circuit board Akihiro Horiguchi, Mitsuo Kasori, Fumio Ueno 1994-01-25
5176309 Method of manufacturing circuit board Akihiro Horiguchi, Mitsuo Kasori, Fumio Ueno, Mitsuyoshi Endo 1993-01-05
5155665 Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof Nobuyuki Mizunoya 1992-10-13
4987677 Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof Tadashi Tanaka, Kazuo Matsumura, Nobuyuki Mizunoya 1991-01-29
4959507 Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof Tadashi Tanaka, Kazuo Matsumura, Nobuyuki Mizunoya 1990-09-25
4954386 Joined ceramic-metal composite substrate and method for production thereof Nobuyuki Mizunoya, Tadashi Tanaka, Kazuo Matsumura 1990-09-04