Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6316116 | Ceramic circuit board and method of manufacturing the same | Miho Nakamura, Hideki Sato, Keiichi Yano, Tadashi Ishii, Seiko Nagano | 2001-11-13 |
| 6284985 | Ceramic circuit board with a metal plate projected to prevent solder-flow | Takayuki Naba | 2001-09-04 |
| 6040039 | Silicon nitride circuit board | Kazuo Ikeda, Hiroshi Komorita, Yoshitoshi Sato, Michiyasu Komatsu | 2000-03-21 |
| 5998000 | Silicon nitride circuit board | Kazuo Ikeda, Hiroshi Komorita, Yoshitoshi Sato, Michiyasu Komatsu | 1999-12-07 |
| 5928768 | Silicon nitride circuit board | Kazuo Ikeda, Hiroshi Komorita, Yoshitoshi Sato, Michiyasu Komatsu | 1999-07-27 |
| 5744410 | High thermal conductive silicon nitride sintered body, method of producing the same and press-contacted body | Michiyasu Komatsu, Kazuo Ikeda, Yoshitoshi Sato, Tatsuya Imaizumi, Kazuyuki Kondo | 1998-04-28 |
| 5363278 | Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof | Hiroshi Komorita | 1994-11-08 |
| 5328751 | Ceramic circuit board with a curved lead terminal | Hiroshi Komorita, Kazuo Matsumura, Kazuo Ikeda, Takayuki Naba, Tadashi Tanaka | 1994-07-12 |
| 5165983 | Method for production of aluminum nitride ceramic plate | Yasuyuki Sugiura | 1992-11-24 |
| 5155665 | Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof | Hiroshi Komorita | 1992-10-13 |
| 5063121 | Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it | Hideki Sato, Hironori Asai, Kazuo Anzai, Tsuyoshi Hatano | 1991-11-05 |
| 4987677 | Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof | Tadashi Tanaka, Kazuo Matsumura, Hiroshi Komorita | 1991-01-29 |
| 4959507 | Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof | Tadashi Tanaka, Kazuo Matsumura, Hiroshi Komorita | 1990-09-25 |
| 4954386 | Joined ceramic-metal composite substrate and method for production thereof | Hiroshi Komorita, Tadashi Tanaka, Kazuo Matsumura | 1990-09-04 |
| 4906511 | Aluminum nitride circuit board | Hideki Sato, Masakazu Hatori | 1990-03-06 |
| 4901137 | Electronic apparatus having semiconductor device | Hideki Sato | 1990-02-13 |
| 4883704 | Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it | Hideki Sato, Hironori Asai, Kazuo Anzai, Tsuyoshi Hatano | 1989-11-28 |
| 4873151 | Aluminum nitride circuit substrate | Hideki Sato | 1989-10-10 |
| 4849292 | Method for directly bonding ceramic and metal members and laminated body of the same | Hajime Kohama, Yasuyuki Sugiura | 1989-07-18 |
| 4835065 | Composite alumina-aluminum nitride circuit substrate | Hideki Sato | 1989-05-30 |
| 4770953 | Aluminum nitride sintered body having conductive metallized layer | Akihiro Horiguchi, Mituo Kasori, Fumio Ueno, Hideki Sato, Mitsuyoshi Endo +2 more | 1988-09-13 |
| 4761345 | Aluminum nitride substrate | Hideki Sato, Mitsuhiro Nagata | 1988-08-02 |
| 4704320 | Substrate structure | Yasuyuki Sugiura, Masakazu Hatori | 1987-11-03 |
| 4693409 | Method for directly bonding ceramic and metal members and laminated body of the same | Hajime Kohama, Yasuyuki Sugiura | 1987-09-15 |
| 4542073 | Ceramic bonded structure and method of manufacturing the same | Shun Tanaka, Shigeo Abe | 1985-09-17 |