Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6068872 | Vacuum-heat processing method | Toshio Hashiguchi, Nobuo Myojin, Tetsuya Hayashi | 2000-05-30 |
| 5988051 | Vacuum-heat processing apparatus | Toshio Hashiguchi, Nobuo Myojin, Tetsuya Hayashi | 1999-11-23 |
| 5909058 | Semiconductor package and semiconductor mounting part | Keiichi Yano, Hironori Asai, Kaoru Koiwa | 1999-06-01 |
| 5907187 | Electronic component and electronic component connecting structure | Kaoru Koiwa, Koji Yamakawa, Kiyoshi Iyogi, Takaaki Yasumoto | 1999-05-25 |
| 5622769 | Ceramic circuit board having a thermal conductivity substrate | Shoji Kozuka, Masaru Hayashi, Katsuyoshi Oh-Ishi, Takaaki Yasumoto, Hiroshi Endo +3 more | 1997-04-22 |
| 5453991 | Integrated circuit device with internal inspection circuitry | Kouhei Suzuki, Kouji Suzuki, Miki Mori, Akinori Hongu | 1995-09-26 |
| 5412160 | Circuit board | Takaaki Yasumoto, Kaoru Koiwa, Koji Yamakawa, Kiyoshi Iyogi | 1995-05-02 |
| 5326623 | Circuit board | Koji Yamakawa, Kaoru Koiwa, Takaaki Yasumoto, Kiyoshi Iyogi | 1994-07-05 |
| 5041700 | Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure | Kiyoshi Iyogi, Takaaki Yasumoto, Toshirou Yanazawa | 1991-08-20 |
| 5008582 | Electronic device having a cooling element | Chiaki Tanuma, Kazuhiro Itsumi, Tomio Ono, Yuu Kondo, Kazutaka Saito | 1991-04-16 |
| 4970571 | Bump and method of manufacturing the same | Koji Yamakawa, Michihiko Inaba | 1990-11-13 |
| 4963701 | Circuit board | Takaaki Yasumoto | 1990-10-16 |
| 4919731 | Brazing paste | Kiyoshi Iyogi, Takaaki Yasumoto, Toshirou Yanazawa, Masako Nakahashi, Hiromitsu Takeda | 1990-04-24 |
| 4916261 | Circuit substrate and producing method of the same | Truong D. Thanh | 1990-04-10 |
| 4906341 | Method of manufacturing semiconductor device and apparatus therefor | Koji Yamakawa, Kaoru Koiwa | 1990-03-06 |
| 4855251 | Method of manufacturing electronic parts including transfer of bumps of larger particle sizes | Kiyoshi Iyogi, Koji Yamakawa | 1989-08-08 |
| 4835344 | Electronic component parts and method for manufacturing the same | Kiyoshi Iyogi, Takaaki Yasumoto, Toshirou Yanazawa, Masako Nakahashi, Hiromitsu Takeda | 1989-05-30 |
| 4797530 | Ceramic circuit substrates and methods of manufacturing same | — | 1989-01-10 |
| 4772985 | Thick film capacitor | Takaaki Yasumoto, Osamu Furukawa, Mitsuo Harata, Masao Segawa | 1988-09-20 |
| 4659611 | Circuit substrate having high thermal conductivity | Kazuo Anzai, Kazuo Shinozaki, Akihiko Tsuge, Kazutaka Saitoh, Kiyoshi Iyogi +2 more | 1987-04-21 |
| 4584456 | Production of resistor from insulating material by local heating | Hirosi Oodaira, Haruko Suzuki, Masayuki Saito | 1986-04-22 |
| 4412377 | Method for manufacturing a hybrid integrated circuit device | Kenji Nagashima, Hiroshi Matsumoto, Masataka Tanaka, Hirosi Oodaira | 1983-11-01 |