Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7259046 | Semiconductor device and manufacturing method thereof | Hideo Aoki, Yoshiaki Sugizaki, Naoko Yamaguchi | 2007-08-21 |
| 7235425 | Semiconductor device and fabrication method for the same | Hideo Numata | 2007-06-26 |
| 7202563 | Semiconductor device package having a semiconductor element with resin | Takashi Imoto, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more | 2007-04-10 |
| 7095112 | Semiconductor device, semiconductor package member, and semiconductor device manufacturing method | Mitsuyoshi Endo, Mie Matsuo | 2006-08-22 |
| 7071576 | Semiconductor device and method of manufacturing the same | Hideo Nakayoshi | 2006-07-04 |
| 7067398 | Method of producing electronic circuit and electronic circuit | Hideo Aoki, Naoko Yamaguchi, Toshiaki Yamauchi, Koji Imamiya, Hiroshi Hashizume | 2006-06-27 |
| 6977130 | Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit | Hideo Aoki, Atsuko Iida, Yasuyuki Hotta, Naoko Yamaguchi | 2005-12-20 |
| 6861738 | Laminated-chip semiconductor device | Katsuhiko Oyama, Mitsuyoshi Endo, Takashi Yamazaki, Takashi Imoto | 2005-03-01 |
| 6717251 | Stacked type semiconductor device | Mie Matsuo, Nobuo Hayasaka, Tsunetoshi Arikado, Hidemi Ishiuchi, Koji Sakui | 2004-04-06 |
| 6617678 | Semiconductor device | Takashi Yamazaki, Mitsuyoshi Endo, Katsuhiko Oyama, Takashi Imoto, Mikio Matsui | 2003-09-09 |
| 6452115 | Circuit pattern for multi-layer circuit board for mounting electronic parts | Michio Horiuchi, Eiji Yoda | 2002-09-17 |
| 6376907 | Ball grid array type package for semiconductor device | Eiji Takano, Eiichi Hosomi | 2002-04-23 |
| 6329610 | Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board | Yoshizumi Sato, Tomitsugu Kojima, Go TAKEDA | 2001-12-11 |
| 6271478 | Multi-layer circuit board | Michio Horiuchi, Yukiharu Takeuchi | 2001-08-07 |
| 6229099 | Multi-layer circuit board with particular pad spacing | Michio Horiuchi, Eiji Yoda | 2001-05-08 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Naohiko Hirano, Hiroshi Tazawa, Eiichi Hosomi, Kazuhide Doi +2 more | 2000-08-29 |
| 6094057 | Board for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereon | Yoichi Hiruta | 2000-07-25 |
| 6061466 | Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads | Eiichi Hosomi, Hiroshi Tazawa, Koji Shibasaki | 2000-05-09 |
| 6049130 | Semiconductor device using gold bumps and copper leads as bonding elements | Eiichi Hosomi, Hiroshi Tazawa, Koji Shibasaki | 2000-04-11 |
| 5825081 | Tape carrier and assembly structure thereof | Eiichi Hosomi, Hiroshi Tazawa, Koji Shibasaki | 1998-10-20 |
| 5801447 | Flip chip mounting type semiconductor device | Naohiko Hirano, Kazuhide Doi, Hiroshi Tazawa, Eiichi Hosomi, Yoichi Hiruta +2 more | 1998-09-01 |
| 5773888 | Semiconductor device having a bump electrode connected to an inner lead | Eiichi Hosomi, Hiroshi Tazawa, Koji Shibasaki | 1998-06-30 |
| 5747881 | Semiconductor device, method of fabricating the same and copper leads | Eiichi Hosomi, Hiroshi Tazawa, Koji Shibasaki | 1998-05-05 |
| 5712493 | Display device having driving circuits at the periphery of a substrate | Miki Mori, Takeshi Sasaki | 1998-01-27 |
| 5631499 | Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics | Eiichi Hosomi, Hiroshi Tazawa, Ryouichi Miyamoto, Takashi Arai, Koji Shibasaki | 1997-05-20 |