Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9153510 | Semiconductor device and method of manufacturing the same | Masafumi Sugimoto, Atsushi Murakawa, Kazumi Takahashi, Kazuhito Higuchi, Susumu Obata | 2015-10-06 |
| 8723334 | Semiconductor device including semiconductor package | — | 2014-05-13 |
| 8183599 | Semiconductor device with interface circuit and method of configuring semiconductor devices | — | 2012-05-22 |
| 7910956 | Semiconductor device with interface circuit and method of configuring semiconductor devices | — | 2011-03-22 |
| 7817439 | System and apparatus for power distribution for a semiconductor device | — | 2010-10-19 |
| 7531751 | Method and system for an improved package substrate for use with a semiconductor package | Yuichi Goto | 2009-05-12 |
| 7501698 | Method and system for an improved power distribution network for use with a semiconductor device | — | 2009-03-10 |
| 7492570 | Systems and methods for reducing simultaneous switching noise in an integrated circuit | Paul M. Harvey | 2009-02-17 |
| 7227260 | Method and system for a pad structure for use with a semiconductor package | Yuichi Goto | 2007-06-05 |
| 7087988 | Semiconductor packaging apparatus | — | 2006-08-08 |
| 6960494 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2005-11-01 |
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2004-12-28 |
| 6768206 | Organic substrate for flip chip bonding | — | 2004-07-27 |
| 6740981 | Semiconductor device including memory unit and semiconductor module including memory units | — | 2004-05-25 |
| 6551854 | Semiconductor device having bump electrodes and method of manufacturing the same | Yasuhiro Koshio | 2003-04-22 |
| 6469373 | Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor | Hiroshi Funakura | 2002-10-22 |
| 6376907 | Ball grid array type package for semiconductor device | Eiji Takano, Chiaki Takubo | 2002-04-23 |
| 6159837 | Manufacturing method of semiconductor device | Yasuhiro Yamaji | 2000-12-12 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Naohiko Hirano, Hiroshi Tazawa, Chiaki Takubo, Kazuhide Doi +2 more | 2000-08-29 |
| 6061466 | Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads | Chiaki Takubo, Hiroshi Tazawa, Koji Shibasaki | 2000-05-09 |
| 6049130 | Semiconductor device using gold bumps and copper leads as bonding elements | Hiroshi Tazawa, Chiaki Takubo, Koji Shibasaki | 2000-04-11 |
| 5825081 | Tape carrier and assembly structure thereof | Chiaki Takubo, Hiroshi Tazawa, Koji Shibasaki | 1998-10-20 |
| 5801447 | Flip chip mounting type semiconductor device | Naohiko Hirano, Kazuhide Doi, Chiaki Takubo, Hiroshi Tazawa, Yoichi Hiruta +2 more | 1998-09-01 |
| 5773888 | Semiconductor device having a bump electrode connected to an inner lead | Chiaki Takubo, Hiroshi Tazawa, Koji Shibasaki | 1998-06-30 |
| 5747881 | Semiconductor device, method of fabricating the same and copper leads | Hiroshi Tazawa, Chiaki Takubo, Koji Shibasaki | 1998-05-05 |