Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8618657 | Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same | Kiichiro Higaki, Koichi Sugihara, Katsuya Murakami, Shigenori Sawachi | 2013-12-31 |
| 7148529 | Semiconductor package | Masatoshi Fukuda, Yasuhiro Koshio, Hiroshi Funakura | 2006-12-12 |
| 6960494 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano +4 more | 2005-11-01 |
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano +4 more | 2004-12-28 |