Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721905 | Semiconductor package and mobile device using the same | Keiju Yamada, Takashi Yamazaki, Masatoshi Fukuda | 2017-08-01 |
| 9362196 | Semiconductor package and mobile device using the same | Keiju Yamada, Takashi Yamazaki, Masatoshi Fukuda | 2016-06-07 |
| 9165961 | Solid-state imaging device | Mitsuhiro Iwama | 2015-10-20 |
| 8409919 | Method for manufacturing semiconductor device | Hideo Aoki, Masatoshi Fukuda, Kanako Sawada | 2013-04-02 |
| 7148529 | Semiconductor package | Mitsuru Oida, Masatoshi Fukuda, Hiroshi Funakura | 2006-12-12 |
| 6960494 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2005-11-01 |
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2004-12-28 |
| 6551854 | Semiconductor device having bump electrodes and method of manufacturing the same | Eiichi Hosomi | 2003-04-22 |
| 6392143 | Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same | — | 2002-05-21 |
| 6198161 | Semiconductor device | — | 2001-03-06 |