Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7148529 | Semiconductor package | Mitsuru Oida, Masatoshi Fukuda, Yasuhiro Koshio | 2006-12-12 |
| 6960494 | Semiconductor package and method of manufacturing the same | Eiichi Hosomi, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2005-11-01 |
| 6836012 | Semiconductor package and method of manufacturing the same | Eiichi Hosomi, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2004-12-28 |
| 6469373 | Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor | Eiichi Hosomi | 2002-10-22 |