Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960494 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Yasuhiro Koshio, Junya Nagano, Mitsuru Oida +4 more | 2005-11-01 |
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Yasuhiro Koshio, Junya Nagano, Mitsuru Oida +4 more | 2004-12-28 |
| 5292050 | Wire bonder | Kazuhiro Yamamori | 1994-03-08 |
| 5045919 | Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step | — | 1991-09-03 |