Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8128731 | Method for separating and enriching isotope material, multistage rotor, and apparatus for separating and enriching isotope material | Tsutomu Mashimo, Masao Ono, Xinsheng Huang, Yusuke Iguchi, Satoru Okayasu +2 more | 2012-03-06 |
| 6820503 | High-speed rotation testing apparatus | Masanori Sueyoshi, Akira Tezuka, Xinsheng Huang, Toyotaka Osakabe, Masao Ono +1 more | 2004-11-23 |
| 6615670 | High-speed rotation testing apparatus | Takeshi Watabe, Shiro Shibasaki | 2003-09-09 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Naohiko Hirano, Hiroshi Tazawa, Eiichi Hosomi, Chiaki Takubo +2 more | 2000-08-29 |
| 6061466 | Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads | Chiaki Takubo, Eiichi Hosomi, Hiroshi Tazawa | 2000-05-09 |
| 6049130 | Semiconductor device using gold bumps and copper leads as bonding elements | Eiichi Hosomi, Hiroshi Tazawa, Chiaki Takubo | 2000-04-11 |
| 5825081 | Tape carrier and assembly structure thereof | Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa | 1998-10-20 |
| 5801447 | Flip chip mounting type semiconductor device | Naohiko Hirano, Kazuhide Doi, Chiaki Takubo, Hiroshi Tazawa, Eiichi Hosomi +2 more | 1998-09-01 |
| 5773888 | Semiconductor device having a bump electrode connected to an inner lead | Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa | 1998-06-30 |
| 5747881 | Semiconductor device, method of fabricating the same and copper leads | Eiichi Hosomi, Hiroshi Tazawa, Chiaki Takubo | 1998-05-05 |
| 5631499 | Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics | Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa, Ryouichi Miyamoto, Takashi Arai | 1997-05-20 |
| 5615822 | Method and apparatus for controlling bonding load of fine lead electrode | Chiaki Takubo, Hiroshi Tazawa, Eiichi Hosomi | 1997-04-01 |