Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9236329 | Semiconductor memory card | Soichi Homma, Katsuyoshi Watanabe, Taku Nishiyama, Takeshi Ikuta, Naohisa Okumura | 2016-01-12 |
| 9033248 | Semiconductor storage device | Hidetoshi Suzuki, Yuichi Hotta, Yuji Shimoda, Yuuji Ogawa, Taku Nishiyama +5 more | 2015-05-19 |
| 8575738 | Semiconductor memory card | Naohisa Okumura, Taku Nishiyama, Katsuyoshi Watanabe, Takeshi Ikuta | 2013-11-05 |
| 6742701 | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus | Masahiko Furuno, Tsugunori Masuda, Hideo Aoki | 2004-06-01 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Naohiko Hirano, Hiroshi Tazawa, Eiichi Hosomi, Chiaki Takubo +2 more | 2000-08-29 |
| 5801447 | Flip chip mounting type semiconductor device | Naohiko Hirano, Chiaki Takubo, Hiroshi Tazawa, Eiichi Hosomi, Yoichi Hiruta +2 more | 1998-09-01 |
| 5648686 | Connecting electrode portion in semiconductor device | Naohiko Hirano, Masayuki Miura, Takashi Okada, Yoichi Hiruta | 1997-07-15 |
| 5645123 | Semiconductor device having temperature regulation means formed in circuit board | Naohiko Hirano | 1997-07-08 |
| 5629566 | Flip-chip semiconductor devices having two encapsulants | Masayuki Miura, Takashi Okada, Naohiko Hirano, Yoichi Hiruta | 1997-05-13 |
| 5530289 | Semiconductor device and method of manufacturing the same | Naohiko Hirano | 1996-06-25 |