TM

Tsugunori Masuda

KS Kabushiki Kaisha Kitamura Seisakusho: 8 patents #1 of 21Top 5%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
Overall (All Time): #662,936 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
6742701 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus Masahiko Furuno, Hideo Aoki, Kazuhide Doi 2004-06-01
6364195 Brazing Apparatus Junichi Onozaki, Hiroshi Saito 2002-04-02
6050473 Brazing apparatus Junichi Onozaki, Hiroshi Saito 2000-04-18
5981922 Brazing apparatus having electromagnetic induction pumps for moving a brazing filler metal in contact with a workpiece Junichi Onozaki, Hiroshi Saito 1999-11-09
4846390 Automatic soldering apparatus Shinsaku Kuranari, Yu Fukuhara 1989-07-11
4787550 Automatic soldering apparatus Shinsaku Kuranari, Yu Fukuhara 1988-11-29
4682563 Jig for supporting array of articles to be soldered and device for transferring articles to jig Shoji Muto 1987-07-28
4603804 Automatic soldering apparatus Kota Takeda 1986-08-05