Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8104661 | Heating device, reflow device, heating method, and bump forming method | Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Masaru Shirai | 2012-01-31 |
| 8042727 | Heater, reflow apparatus, and solder bump forming method and apparatus | Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Haruhiko Ando +1 more | 2011-10-25 |
| 7350686 | Method for supplying solder | Junichi Onozaki, Hiroshi Saito, Haruhiko Andou, Isao Sakamoto, Masaru Shirai +1 more | 2008-04-01 |
| 6742701 | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus | Tsugunori Masuda, Hideo Aoki, Kazuhide Doi | 2004-06-01 |