Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5198883 | Semiconductor device having an improved lead arrangement and method for manufacturing the same | Kenji Takahashi, Yasuhiro Yamaji, Susumu Harada, Kazuichi Komenaka, Mitsugu Miyamoto +4 more | 1993-03-30 |
| 5096081 | Cover plate for semiconductor devices | Masamichi Shindo, Hideo Taguchi, Nobu Izawa | 1992-03-17 |
| 5091341 | Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member | Junichi Asada, Kenji Takahashi | 1992-02-25 |
| 5025347 | Semiconductor device | Masamichi Shindo, Hideo Taguchi, Nobu Izawa | 1991-06-18 |
| 4910577 | Lead frame | Atsushi Sonoda, Akinori Nakatsuru, Tetsuo Ito | 1990-03-20 |
| 4855807 | Semiconductor device | Yasuhiro Yamaji, Kenji Takahashi, Seiichi Hirata | 1989-08-08 |
| 4654692 | Semiconductor device of resin-seal type | Seiichi Hirata | 1987-03-31 |
| 4604642 | Fe-Ni-Cu leadframe | — | 1986-08-05 |
| 4482611 | Electronic parts | Koichi Teshima, Masakazu Yamada, Takemi Abe | 1984-11-13 |