Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462449 | Semiconductor device | Hiroshi Sato, Yoshinori Murakami, Hidekazu Tanisawa, Shinji Sato, Kazuhiro Mitamura +1 more | 2022-10-04 |
| 10461050 | Bonding pad structure of a semiconductor device | Hidekazu Tanisawa, Shinji Sato, Hiroshi Sato, Kenichi Koui, Hiroki Takahashi +1 more | 2019-10-29 |
| 9984956 | Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof | Masahiro Aoyagi, Tung Thanh Bui, Naoya Watanabe, Katsuya Kikuchi | 2018-05-29 |
| 9627347 | Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus | Masahiro Aoyagi, Thanh Tung Bui, Motohiro Suzuki, Naoya Watanabe, Lai Na Ma +1 more | 2017-04-18 |