Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462449 | Semiconductor device | Hiroshi Sato, Yoshinori Murakami, Shinji Sato, Fumiki Kato, Kazuhiro Mitamura +1 more | 2022-10-04 |
| 10461050 | Bonding pad structure of a semiconductor device | Shinji Sato, Fumiki Kato, Hiroshi Sato, Kenichi Koui, Hiroki Takahashi +1 more | 2019-10-29 |
| 9698082 | Au-based solder die attachment semiconductor device and method for manufacturing the same | Satoshi Tanimoto, Shinji Sato, Kohei Matsui | 2017-07-04 |