Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8388786 | Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet | Takashi HABU, Fumiteru Asai, Tomokazu Takahashi, Akinori Nishio | 2013-03-05 |
| 7943235 | Adhesive sheet for processing semiconductor substrates | Akiyoshi Yamamoto, Fumiteru Asai, Kouichi Hashimoto | 2011-05-17 |
| 7727811 | Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate | Fumiteru Asai | 2010-06-01 |
| 6841737 | Wired circuit board | Makoto Komatsubara, Shigenori Morita, Tadao Ookawa | 2005-01-11 |
| 6717059 | Circuit board and connection structure of terminal portion of the same | Yasuhito Ohwaki | 2004-04-06 |