Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8722517 | Dicing tape-integrated film for semiconductor back surface | Goji Shiga, Fumiteru Asai, Toshimasa SUGIMURA | 2014-05-13 |
| 8703584 | Dicing tape-integrated film for semiconductor back surface | Sadahito Misumi | 2014-04-22 |
| 8704382 | Film for flip chip type semiconductor back surface | Takeshi Matsumura, Goji Shiga | 2014-04-22 |
| 8692389 | Dicing tape-integrated film for semiconductor back surface | Takeshi Matsumura, Goji Shiga | 2014-04-08 |
| 8679931 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Fumiteru Asai, Goji Shiga | 2014-03-25 |
| 8652938 | Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device | Goji Shiga, Fumiteru Asai | 2014-02-18 |
| 8648476 | Dicing tape-integrated wafer back surface protective film | Takeshi Matsumura | 2014-02-11 |
| 8643194 | Dicing tape-integrated film for semiconductor back surface | Goji Shiga, Fumiteru Asai, Akiyoshi Yamamoto, Tomokazu Takahashi | 2014-02-04 |
| 8558397 | Dicing tape-integrated wafer back surface protective film | Takeshi Matsumura | 2013-10-15 |
| 8518745 | Method of manufacturing semiconductor device having a bumped wafer and protective layer | Takashi Oda, Takeshi Matsumura | 2013-08-27 |
| 8513816 | Film for flip chip type semiconductor back surface containing thermoconductive filler | Goji Shiga, Fumiteru Asai | 2013-08-20 |
| 8492907 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Goji Shiga, Fumiteru Asai | 2013-07-23 |
| 8455302 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Goji Shiga, Fumiteru Asai | 2013-06-04 |
| 8450189 | Film for flip chip type semiconductor back surface | Goji Shiga, Fumiteru Asai | 2013-05-28 |
| 8420510 | Method of manufacturing semiconductor device | Takashi Oda, Hiroyuki Senzai | 2013-04-16 |
| 8420509 | Film for flip chip type semiconductor back surface | Takeshi Matsumura, Goji Shiga | 2013-04-16 |
| 8415201 | Dicing tape-integrated film for semiconductor back surface | Miki Hayashi | 2013-04-09 |
| 8404522 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Goji Shiga, Fumiteru Asai | 2013-03-26 |
| 8269213 | Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same | Hiroshi Noro, Eiji Toyoda | 2012-09-18 |
| 8237294 | Dicing tape-integrated wafer back surface protective film | Takeshi Matsumura | 2012-08-07 |
| 7829441 | Thermosetting die-bonding film | — | 2010-11-09 |
| 7611926 | Thermosetting die bonding film | Sadahito Misumi, Takeshi Matsumura, Yasuhiro Amano, Masami Oikawa, Tsubasa Miki | 2009-11-03 |
| D589473 | Adhesive film material for use in manufacturing semiconductors | Sadahito Misumi, Takeshi Matsumura, Yasuhiro Amano | 2009-03-31 |