Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9153556 | Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method | Takeshi Matsumura, Kazuhito Hosokawa, Hiroyuki Kondo | 2015-10-06 |
| 9105754 | Adhesive film, method of manufacturing semiconductor device, and semiconductor device | Yuichiro Shishido, Kenji Onishi | 2015-08-11 |
| 8975759 | Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby | Takeshi Matsumura, Kazuhito Hosokawa, Hiroyuki Kondo | 2015-03-10 |
| 8890190 | Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component | Hisataka Ito, Yasushi Inoue | 2014-11-18 |
| 8703584 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto | 2014-04-22 |
| 8642362 | Method for producing light-emitting diode device | Hisataka Ito, Yasushi Inoue | 2014-02-04 |
| 8592260 | Process for producing a semiconductor device | Masami Oikawa, Takeshi Matsumura | 2013-11-26 |
| 8580617 | Thermosetting die-bonding film | Yuki Sugo, Takeshi Matsumura | 2013-11-12 |
| 8304341 | Dicing die-bonding film | Takeshi Matsumura, Masaki Mizutani | 2012-11-06 |
| 8278153 | Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby | Takeshi Matsumura, Kazuhito Hosokawa, Hiroyuki Kondo | 2012-10-02 |
| 8236614 | Semiconductor device manufacturing method | Takeshi Matsumura | 2012-08-07 |
| 8143106 | Thermosetting die-bonding film | Yuki Sugo, Takeshi Matsumura | 2012-03-27 |
| 7998552 | Dicing/die bonding film | Yasuhiro Amano, Takeshi Matsumura | 2011-08-16 |
| 7863182 | Dicing die-bonding film | Takeshi Matsumura, Masaki Mizutani | 2011-01-04 |
| 7780811 | Dicing die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura, Masaki Mizutani | 2010-08-24 |
| 7772040 | Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby | Takeshi Matsumura, Kazuhito Hosokawa, Hiroyuki Kondo | 2010-08-10 |
| 7611926 | Thermosetting die bonding film | Naohide Takamoto, Takeshi Matsumura, Yasuhiro Amano, Masami Oikawa, Tsubasa Miki | 2009-11-03 |
| D589473 | Adhesive film material for use in manufacturing semiconductors | Naohide Takamoto, Takeshi Matsumura, Yasuhiro Amano | 2009-03-31 |
| 7508081 | Dicing die-bonding film | Takeshi Matsumura, Masaki Mizutani | 2009-03-24 |
| 7449226 | Dicing die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura, Masaki Mizutani | 2008-11-11 |
| D549189 | Dicing die-bonding film | Takeshi Matsumura | 2007-08-21 |
| 7232709 | Process for producing a semiconductor device | Takeshi Matsumura, Kazuhito Hosokawa, Hiroyuki Kondou | 2007-06-19 |
| 6896994 | Battery separator containing carbodiimide polymer | Masakatsu Urairi, Keisuke Kii, Yutaka Kishii, Yutaka Yamamura, Masao Abe | 2005-05-24 |
| 6811927 | Battery containing a polycarbodiimide polymer | Masakatsu Urairi, Keisuke Kii, Yutaka Kishii, Yutaka Yamamura, Masao Abe +1 more | 2004-11-02 |
| 6669869 | Anisotropic conductive film | Miho Yamaguchi, Yuji Hotta | 2003-12-30 |