| 9123794 |
Dicing die bond film |
Miki Morita, Yuta Kimura |
2015-09-01 |
| 8524007 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus |
Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Akihisa Murata |
2013-09-03 |
| 8475600 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus |
Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Akihisa Murata |
2013-07-02 |
| 7998552 |
Dicing/die bonding film |
Sadahito Misumi, Takeshi Matsumura |
2011-08-16 |
| 7793668 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
Makoto Namikawa, Yoshio Terada, Jirou Nukaga, Eiji Toyoda, Hirofumi Fujii +4 more |
2010-09-14 |
| 7611926 |
Thermosetting die bonding film |
Naohide Takamoto, Sadahito Misumi, Takeshi Matsumura, Masami Oikawa, Tsubasa Miki |
2009-11-03 |
| 7575812 |
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor |
Yoshio Terada, Hirofumi Fujii, Makoto Namikawa, Daisuke Uenda |
2009-08-18 |
| D589473 |
Adhesive film material for use in manufacturing semiconductors |
Naohide Takamoto, Sadahito Misumi, Takeshi Matsumura |
2009-03-31 |
| 6437631 |
Analog multiplying circuit and variable gain amplifying circuit |
— |
2002-08-20 |
