Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308228 | Manufacturing method for semiconductor silicon wafer | Shingo Narimatsu | 2025-05-20 |
| 12046469 | Manufacturing method for semiconductor silicon wafer | Shingo Narimatsu | 2024-07-23 |
| 10141180 | Silicon wafer and method for manufacturing the same | Koji Araki, Tatsuhiko Aoki, Haruo Sudo | 2018-11-27 |
| 9421712 | Laser joining method | Satoshi Arai | 2016-08-23 |
| 9059099 | Thermal treatment method of silicon wafer and silicon wafer | Koji Araki | 2015-06-16 |
| 8999864 | Silicon wafer and method for heat-treating silicon wafer | Hiromichi Isogai, Eiji Toyoda, Koji Araki, Tatsuhiko Aoki, Haruo Sudo +4 more | 2015-04-07 |
| 8476149 | Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process | Hiromichi Isogai, Eiji Toyoda, Kumiko Murayama, Koji Izunome, Susumu Maeda +7 more | 2013-07-02 |
| 8399341 | Method for heat treating a silicon wafer | Hiromichi Isogai, Eiji Toyoda, Kumiko Murayama, Koji Araki, Tatsuhiko Aoki +4 more | 2013-03-19 |
| 8252700 | Method of heat treating silicon wafer | Hiromichi Isogai, Eiji Toyoda, Kumiko Murayama, Koji Araki, Tatsuhiko Aoki +4 more | 2012-08-28 |
| 7977219 | Manufacturing method for silicon wafer | Hiromichi Isogai, Eiji Toyoda, Kumiko Murayama, Koji Izunome, Susumu Maeda +1 more | 2011-07-12 |
| 7679730 | Surface inspection apparatus and surface inspection method for strained silicon wafer | Hideaki Takano, Miyuki Shimizu, Koji Izunome, Yoshinori Hayashi, Kazuhiko Hamatani | 2010-03-16 |
| 7250357 | Manufacturing method for strained silicon wafer | Koji Izunome | 2007-07-31 |
| 7247583 | Manufacturing method for strained silicon wafer | Hisatsugu Kurita, Masato Igarashi, Koji Izunome | 2007-07-24 |
| 7060597 | Manufacturing method for a silicon substrate having strained layer | Hisatsugu Kurita, Masato Igarashi, Koji Izunome | 2006-06-13 |